PCB MANUFACTURER IN CHINA
PCB Manufacturing Capabilities: Full Spec Tables
Use these PCB fabrication and assembly tables to assess an initial project fit and prepare an engineering inquiry. The values are reference limits for discussion. Final acceptance depends on the complete design, construction, materials, quantity and required quality evidence.
Limits in different rows are not automatically available together. A board that combines fine geometry, heavy copper, advanced vias and tight mechanical tolerances needs a combined review. Request written confirmation of the actual production specification before releasing the order.
Fabrication scope for inquiry
| Technology or feature | Reference scope | What to confirm |
|---|---|---|
| Rigid PCB | 1–56 layers | Material, stack-up, finished thickness and production quantity. |
| Flexible PCB | 1–12 layers | Flex construction, bend conditions, coverlay and stiffeners. |
| Rigid-flex PCB | 2–32 layers | Total and flexible layer counts, transitions and mechanical drawing. |
| Fine line and space | Down to 3 mil in the reference rigid scope | Layer, copper thickness and the affected feature locations. |
| Heavy copper | Up to 12 oz in the reference scope | Inner versus finished outer copper and compatible geometry. |
| HDI laser microvias | 0.1 mm reference feature | Via definition, dielectric depth, layer span and filling requirements. |
| HDI build-up | 1+N+1 through 4+N+4 | Approved stack-up and stacked or staggered via arrangement. |
| Controlled impedance | Available for inquiry | Target, tolerance, geometry, material and measurement record. |
Numerical scope: manufacturing capability reference. The table uses the overview’s rigid-layer range rather than the higher limits appearing in some detailed pages. Unconfirmed production yield, throughput, lead time and facility ownership are not represented by these values.
Materials and construction details
Reference construction families include FR-4, high-Tg and halogen-free rigid boards; flexible materials; RF materials; and metal-core construction. Specify the required grade when it is part of the product design. A material family alone does not identify a qualified substitute. See the rigid-board material and process reference for the published family overview.
| Requirement | Include with the files | Approval needed |
|---|---|---|
| Laminate | Manufacturer, grade or an explicit performance specification. | Any proposed equivalent material. |
| Copper | Separate inner and finished outer requirements. | Geometry or stack-up changes needed for the copper. |
| Surface finish | Finish type, affected areas and special contact requirements. | Alternatives or mixed-finish processing. |
| Holes and vias | Finished sizes, plating status and layer connections. | Changed via spans, filling or drilling assumptions. |
| Flex regions | Bend drawing, installed shape and movement conditions. | Proposed flex stack-up and bend restrictions. |
| Mechanical fit | Dimensioned profile, cutouts, tolerances and critical interfaces. | Any deviation that could affect assembly fit. |
Assembly scope for inquiry
| Feature | Reference scope | Required project input |
|---|---|---|
| Assembly route | SMT and through-hole | BOM, placement file and assembly drawing. |
| Small passives | Down to 01005 | Exact part numbers, package drawings and land patterns. |
| BGA pitch | Down to 0.2 mm in the reference scope | Package-specific review and inspection requirements. |
| Inspection | SPI, AOI and X-ray | Inspection locations, coverage and required records. |
| Electrical and functional test | ICT and FCT | Test access, fixtures, procedures and pass/fail limits. |
| Component supply | Turnkey or consigned | Ownership by BOM line and substitution permissions. |
Assembly scope: assembly capability reference. Do not infer that the smallest package or pitch is routine for every board. Review pad geometry, adjacent components, board support and test expectations before committing the layout.
What an engineering confirmation should say
Ask for the response to identify the submitted revision, accepted stack-up, materials, controlled dimensions and testing scope. Any change should be tied to a specific requirement and remain open until approved. A general “within capability” response is less useful than a marked drawing or a concise deviation list.
Keep the accepted specification with the purchase order. On a reorder, state whether the material, assembly variant, programming image or delivery documentation has changed. Referencing only an old order number makes it harder to determine which instructions still apply.
Prepare the next step
Read PCB manufacturing for board-family selection, PCB assembly for sourcing and test preparation, and quality control for evidence to request. The quote checklist brings the required files together.